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          PRODUCT >Laminated molded products series

        Epoxy board

        Specification :0.5-0 .8 mm
        1-2mm
        3-55mm
            Description:
        This product is bonded with epoxy resin heated pressure produced in temperature mechanical properties, electrical properties and stability at high temperatures.
        Product Use:
        Applicable to mechanical, electrical and electronic high insulation parts with high mechanical and dielectric properties of good heat resistance and moisture resistance.
         

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